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| ⒐Feature |
→半导体,PCB,LED领域适用设备
→根据客户需要进行移动的COMPACT型设备 |
| ⒐Specification |
→90kv,100uA(0.1mA)
→ 5 micron focus(sealed
type)
→ magnification Max.500x
→ P.C控制 & Joystick控制进行
→ Software ZET1安装各种测定功能及
2D,3D,Histogram（标准配置）
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
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| ⒐Feature |
→ BGA,CSP,SMT,柔性PCB,手机电池等电子部品检查
→ 高倍率放大提高画像清晰度 |
| ⒐Specification |
→ 100kv,100uA(0.1mA)
→ 5 micron focus(sealed
type)
→ magnification Max.600x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及2D,3D,Histogram,Table自动位置决定功能（标准配置）
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ-Yθ45?)为Option
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| ⒐Feature |
→ BGA,POWER TR,SMT,FBT等电子部品检查用装置
→ 表面贴装Soldering状态确认及高倍率检查 |
| ⒐Specification |
→ 130kv,100uA(0.1mA)
→ 8 micron focus(sealed
type)
→ magnification Max.400x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及2D,3D,Histogram,Table自动位置决定
（标准配置）
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ45.)(Xθ-Yθ45.)为
Option |
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| ⒐Feature |
→ 强透过率、超微焦点实现高倍率检查
→ 温湿度控制器 Pipe内部检查,电子绝缘体,表面贴装基板Soldering状态检查
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| ⒐Specification |
→ 150kv,500uA(0.5mA)
→ 5 micron focus(sealed
type)
→ magnification Max.500x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及2D,3D,Histogram,Table自动位置决定功能（标准
配置）
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ45.)(Xθ-Yθ45.)为
Option |
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| ⒐Feature |
→ 1 micron设备最大放大倍率1800x
→ 精密部品分析,检查,表面贴装基板 Soldering状态检查
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| ⒐Specification |
→ 160kv,200uA(0.2mA)
→0.4 micron focus(Open Tube-Filament交替型)
→ magnification Max.1800x
→ P.C控制 & Joystick控制
→ ZET1-XT安装各种测定功能及2D,3D,Histogram,Table自动位置决定功能（标准配置）
→ Table X-Y-Z-Axis&
Camera Z-Axis,Manipulator
→ Table tilting(Xθ45.)(Xθ-Yθ45.)为
Option |
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